Engineering technical support
Technical Consulting
Our technical team is here to answer your questions about chip design.
0512-67315296
Business Consulting
Our sales team will provide you with commercial support regarding chips.
0512-89162663
Engineering technical support
FAB Selection
There are a large number of FABs in the world, and the processes of each FAB vary greatly. Design companies have little knowledge of the processes that are standard for their products, and their choices are narrow.
Process selection
There are many differences in device parameters under various processes. For example, for the same BCD process, a FAB can have several options, and different device parameters have an impact on product performance and reliability.
Communication costs
Fabs are generally more powerful, with more complicated processes, high communication costs, and relatively low communication efficiency. In many cases, it takes a week or even longer to apply for a document.
Capacity price
Design companies do not understand the wafer fab capacity arrangement plan and mechanism, and often cannot get capacity when the plant is at full capacity, and often cannot get good prices when the plant is not at full capacity.
Delivery time control
For design companies, they are unfamiliar with the wafer fab's tape-out and production processes, making it difficult to effectively shorten production time and apply for high-level resources.
Operations management
Communicating with wafer fabs is a long process that requires long-term cooperation to build mutual trust. For many design companies, they invest a lot in operations but still get poor results.